page 1 recommended applications car audio, electric household appliances, oa/fa, pc/peripheral equipment, other general applications ? outer dimension 3.0 x 1.5 x 1.5mm ( l x w x h ) ? flat lenz type ? total output power : 5mw typ. (i f =20ma) ? lead?free soldering compatible ? rohs compliant peak wavelength 880nm product features die materials gaalas x = 130 deg., y = 135 deg. features package 3216 type, water clear epoxy rank grouping parameter soldering methods esd 2kv (hbm) sorted by radiant inte nsity per rank taping half intensity angle assembly method auto pick & place machine (auto mounter) taping and reel 2,500pcs per reel in a 8mm width tape. (standard) reel diameter: 180mm DNP1101W surface mount ired/flat lenz type reflow soldering and manual soldering please refer to soldering conditions about soldering. 2007.8.31
page 2 2004.11.17 DNP1101W surface mount ired/flat lenz type absolute maximum ratings item symbol unit power dissipation pd mw forward current i f ma pulse forward current 1 i fr m ma S i f ma/ S i frm ma/ reverse voltage v r v operating temperature t opr storage temperature t stg 1 ifrm measurement condition : pulse width Q 100 s, duty Q 1/100 electro-optical characteristics conditions typ. 1.35 max. 1.6 reverse current v r =5v i r max. 100 a min. 0.5 typ. 1 total output power i f =20ma po typ. 5 mw peak wavelength i f =20ma p typ. 880 nm spectral half-width i f =20ma S typ. 40 nm 130( x) 135( y) min. - typ. 12 response time i f =20ma tr/tf typ. 30 ns typ. deg. derating (ta=25 or higher) item symbol characteristics 0.67 4 5 -30 +85 -40 +100 absolute maximum ratings 80 50 300 v mw/sr unit forward voltage i f =20ma v f mhz cut-off frequency i f =20ma dc 5ma, -3db from 0.1mhz radiant intensity i f =20ma i e fc half intensity angle i f =20ma 2 1/2 (ta=25 ) (ta=25 )
min . ma x . a0.51.0 b0.71.4 c1.02.0 d1.42.8 e2.04.0 i e mw/s r i f = 20ma condition rank page 3 please contact our sales staff concerning rank designation. 2004.11.17 DNP1101W (ta=25 ) surface mount ired/flat lenz type radiant intensity rank
page 4 DNP1101W technical data spatial distribution example condition : ta = 25 spectral distribution relative intensity vs. wavelength condition : ta = 25 , i f = 50ma wavelength [nm] relative intensity forward voltage vs. forward current condition : ta = 25 forward voltage : v f (v) forward current i f (ma) duty ratio vs. pulse forward current condition : ta = 25 , tw Q 100 s duty ratio pulse forward current i frm (ma) surface mount ired/flat lenz type 2009.1.26
page 5 2004.11.17 DNP1101W technical data ambient temperature vs. pulse forward current condition : tw Q 100 s, duty Q 1/100 ambient temperature : ta( ) ambient temperature vs. forward current ambient temperature : ta( ) forward current : i f (ma) ambient temperature vs. forward voltage condition : i f = 50ma ambient temperature : ta ( ) pulse forward current i frm (ma) forward voltage v f (v) surface mount ired/flat lenz type pulse forward voltage vs. pulse forward current condition : ta=25 , tw Q 100 s, duty Q 1/100 pulse forward voltage : v fm (v) pulse forward current i frm (ma)
page 6 2004.11.17 DNP1101W technical data forward current vs. relative total power condition : - - pulse, tw Q 100 s, duty Q 1/100, ta = 25 forward current : i f (ma) ambient temperature vs. peak wavelength condition : i f = 50ma ambient temperature : ta( ) peak wavelength p(nm) relative total power ambient temperature vs. relative total power condition : i f = 50ma ambient temperature : ta ( ) frequency condition : ta = 25 , i f = 20ma dc 5ma frequency (mhz) relative radiant intensity (db) relative total power surface mount ired/flat lenz type
page 7 DNP1101W surface mount ired/flat lenz type package dimensions recommended soldering pattern (unit: mm) taping specification (unit: mm) (unit: mm) quantity: 2,500pcs/ reel (standard) weight: (7.80)mg 2004.11.17
DNP1101W page 8 surface mount ired/flat lenz type reflow soldering conditions manual soldering conditions iron tip temp. soldering time and frequency 3 s 1 time 350 (max.) (max.) (max.) (30 w max.) 1) the above profile temperature gives the ma ximum temperature of the led resin surface. please set the temperature so as to avoid exceeding this range. 2) total times of reflow soldering pr ocess shall be no more than 2 times. when the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the led from absorbing moisture. 3) temperature fluctuation to the led during the pre-heating process shall be minimized. 2007.8.31
DNP1101W page 9 surface mount ired/flat lenz type reliability testing result failure criteria reliability testing result applicable standard duration failure room temp. operating life eiaj ed- 4701/100(101) 1,000 h 0/25 resistance to soldering heat eiaj ed- 4701/300(301) twice 0/25 temperature cycling eiaj ed- 4701/100(105) 5 cycles 0/25 wet high temp. storage life eiaj ed- 4701/100(103) 1,000 h 0/25 high temp. storage life eiaj ed- 4701/200(201) 1,000 h 0/25 low temp. storage life eiaj ed- 4701/200(202) 1,000 h 0/25 vibration, variable frequency eiaj ed- 4701/400(403) 2 h 0/10 98.1m/s 2 (10g), 100 2khz sweep for 20min., xyz each direction testing conditions ta = 25 , i f = maxium rated current minimum rated storage temperature(30min) normal temperature(15min) maximum rated storage temperature(30min) normal temperature(15min) ta = 60 2 , rh = 90 5% (pretreatment) individual standard (reflow soldering) pre-heating 150 180 120s operating heating 230 min. peak temperature 260 ta = maximum rated storage temperature ta = minimum rated storage temperature items symbols conditions failure criteria radiant intensity i e i f value of each product radiant intensity testing min. value initial value x 0.5 forward voltage v f i f value of each product forward voltage testing max. value spec. max. value x 1.2 reverse current i r v r = maximum rated reverse voltage v testing max. value R spec. max. value x 2.5 2007.8.31 2010.12.30
special notice to customer s using the products and technical information shown in this data sheet DNP1101W page 10 surface mount ired/flat lenz type 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not co nstitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specif ications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sh eets, please adhere to the ma ximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4) the products that have been described to this cata log are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measur ing instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high re liability and safety, and the breakdown and the wrong operation might influence the life or the human body. pl ease consult us beforehand if you plan to use our product for the usages of aircrafts, space borne appl ication, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument. 5) in order to export the products or technologi es described in this data sheet which are under the ?foreign exchange and foreign trade control law,? it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31
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